BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.
- Company：ヘッセ･メカトロニクス･ジャパン
- Price：Other
